X-ray analysis is a useful, non-destructive process that allows us to examine a component's interior structure, including any wire bonding, foreign material, unusual voids, or other possible abnormalities. The interior is also compared to and tested among others from the same batch to ensure uniformity and structural integrity.
Marking Permanence Testing
Resistance to solvent or marking permanence testing determines a product's ability to withstand exposure to different solvents. This ensures that the component markings will not become illegible or damaged when being cleaned or handled. In accordance with the MIL-STD-883, Method 2015A, the component's surface is first exposed to various chemicals and temperatures before being assessed for any abnormalities or evidence of remarking.
Heated Solvent Testing
Heated solvent testing is a more accurate and advanced method of counterfeit detection than a traditional acetone test. Our lab technicians use chemical solvents (1-Methyl 2-Pyrrolidinone and Dynasolve 750) to remove the device's top layer to reveal signs of resurfacing or remarking including sanding, previous markings, differing body material, blacktopping, or pitting.
Decapsulation can be done either mechanically or chemically in order to expose the interior portion of a device. Our lab technicians then inspect the interior and verify the die markings and part numbers as well as die position, orientation, and size.
Using a low-heat oven, moisture-sensitive devices are properly baked according to industry standards to remove any moisture. After baking, the components are dry packed to ensure durability and moisture sensitivity levels.
It consist of 6 levels: Key figures/ specs; Pin check; Function test; DC characteristic values; AC characteristic values; Temperature range check.